Trade fair highlight 14. February 2024

Applications:
- Test cuts through composite parts (soft / hard
combinations) e.g. tires rubber composite profile or
CFK/GFK
- Sawing out a sample part to analyze a specific location
e.g. printed circuit boards, electronic components
- Production of test rods for tensile testing (also
CFK)
- Production of grindings for material testing
Technical features of the DWHS 650
Wire sawing machine for straight cuts
Diamond wire sawing technology is used when
- the workpiece is very fragile and can hardly withstand any clamping forces (feed and
cutting force < 5N).
- no edge chipping is desired, for example when processing green parts
(wire exerts very low forces on the workpiece).
- workpieces are to be cut from hard/soft combinations (wire cleans itself
itself when deflected on the guide rollers).
- a small cutting gap is important.
Diamond wire sawing is a cutting process using
wire on the surface of which diamonds are bound by a
are bonded by a nickel layer. The process is particularly
particularly suitable for cutting brittle-hard materials such as
materials such as silicon, hard metal, sapphire or printed circuit
printed circuit boards. It is also ideal for cutting
composite materials.
The surface finish of the surfaces cut with diamond wire
sawn surfaces corresponds to that of a grinding process.
This means that no further processing steps are
steps are necessary, saving time and resources
resources is a major advantage of the process.